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BGA Solder Balls - 0.45/0.50/0.55 mm

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BGA Solder Balls - 0.45/0.50/0.55 mm
SOL-BGASOLBAL - (0 notes)



Condition: New
Weight: 0.025 kg


5.00 €Incl.
Tax
0% VAT5.00 €Excl.
Tax
Qty. 1+ 2+ 5+
Unit Price 5.00 € 4.75 € 4.50 €
Discount - 5% 10%
Diameter Price Qty
0.45 mm 5.00 € 5
0.50 mm 5.00 € 8
0.55 mm 5.00 € 8

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  • Product in stock dispatched tomorrow
  • Immediate shipment after payment acceptance
  • Return possible within 14 days after delivery
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Solder balls for BGA works on electronical motherboards.
Lead/tin alloy.
 
Key features :
  • BGA solder balls
  • Lead/tin alloy (37/63)
  • Melting point : 179°C
  • Quantity ≃ 25.000 pcs
  • 0.45 mm diameter / 18g bottle (RAM DDR2, DDR3, DDR5)
  • 0.50 mm diameter / 20g bottle (SCEI SouthBridge PS4)
  • 0.55 mm diameter / 22g bottle (APU PS4)
  • Packaging : Glass bottle
  • Diameter at choice
BGA, Solder, Balls, 0.45 mm, 0.50 mm, 0.55 mm, Reballing
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